Full copper wiring in a sub-0.25 μm CMOS ULSI technology
- D. Edelstein
- J. Heidenreich
- et al.
- 1997
- IEDM 1997
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15 results for Charles W. Tobias
Electrochemical Fabrication of Mechanically Robust PbSn C4 Interconnections
- J. Roeder
- H. Deligianni
- et al.
- 1995
- JES
The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects
- H.Y. Cheh
- J. Dukovic
- et al.
- 1993
- JES
The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition
- H.Y. Cheh
- J. Dukovic
- et al.
- 1992
- JES
The application of electrodeposition processes to advanced package fabrication
- S. Krongelb
- J. Dukovic
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990