Cu passivation: A method of inhibiting copper-polyamic acid interactions
- D.Y. Shih
- J. Kim
- et al.
- 1991
- Applied Physics Letters
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4 results for C.H. Yang
Adhesion and deformation of metal/polyimide layered structures
- F. Faupel
- C.H. Yang
- et al.
- 1989
- Journal of Applied Physics
A study of the chemical and physical interaction between copper and polyimide
- D.Y. Shih
- J. Paraszczak
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Stress relaxation during thermal cycling in metal/polyimide layered films
- S.T. Chen
- C.H. Yang
- et al.
- 1988
- Journal of Applied Physics