Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
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67 results for D.Y. Shih
Designs of Low Stress I/O Pin Attach Structures
- D.Y. Shih
- P. Palmateer
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Cu passivation: A method of inhibiting copper-polyamic acid interactions
- D.Y. Shih
- J. Kim
- et al.
- 1991
- Applied Physics Letters
Thin-film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries
- D.Y. Shih
- C.A. Chang
- et al.
- 1991
- Journal of Applied Physics
Oxygen induced adhesion degradation at metai/polyimide interface
- Da-Yuan Shih
- Nancy Klymko
- et al.
- 1991
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
The effect of solvent absorption on the electrical and dielectric properties of polyimide films
- D.Y. Shih
- J. Cataldo
- et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
A study of the chemical and physical interaction between copper and polyimide
- D.Y. Shih
- J. Paraszczak
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films