Preparation of low resistivity Cu-1 at. %Cr thin films by magnetron sputtering
- C. Cabral
- J.M.E. Harper
- et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
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10 results for K. Holloway
HF surface passivation failure in integrated thermal oxidation processing
- M. Liehr
- M. Offenberg
- et al.
- 1990
- SSDM 1990
Tantalum, tantalum nitride, and chromium adhesion to polyimide: Effect of annealing ambient on adhesion
- L.P. Buchwalter
- K. Holloway
- 1998
- Journal of Adhesion Science and Technology
Crystallographic texture change during abnormal grain growth in Cu-Co thin films
- J.M.E. Harper
- J. Gupta
- et al.
- 1994
- Applied Physics Letters
Comparison of high vacuum and ultra-high-vacuum tantalum diffusion barrier performance against copper penetration
- L. Clevenger
- N.A. Bojarczuk
- et al.
- 1993
- Journal of Applied Physics
Comparison of finite element stress analysis results with peel strength at the copper-polyimide interface
- R.H. Lacombe
- L.P. Buchwalter
- et al.
- 1993
- Journal of Adhesion Science and Technology
Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions
- Karen Holloway
- Peter M. Fryer
- et al.
- 1992
- Journal of Applied Physics
Structure of an amorphous TiSi alloy formed by thermal reaction
- Karen Holloway
- Pierre Moine
- et al.
- 1991
- Journal of Non-Crystalline Solids
Ultraclean, integrated processing of thermal oxide structures
- M. Offenberg
- M. Liehr
- et al.
- 1990
- Applied Physics Letters
Tantalum as a diffusion barrier between copper and silicon
- Karen Holloway
- Peter M. Fryer
- 1990
- Applied Physics Letters