True 3-D displays for avionics and mission crewstations
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
The adhesion of Ta, TaN (cubic), TaNx (mixture of cubic and amorphous phases), and Cr to 3,3',4,4'-biphenylene tetracarboxylic acid dianhydride-p-phenylenediamine-derived polyimide (BPDA-PDA PI) has been characterized. The PI surface was subjected to CF4-reactiveion etching (RIE) and Ar-sputtering prior to interface preparation. The peel adhesion at T-0 (initial) shows the following order: TaNx∼ TaN < Ta∼ Cr, with all samples failing in apparently virgin PI. After ten thermal cycles to 400°C in forming gas the peel adhesionshowed the following trend: TaNx < TaN∼ Ta ∼ Cr, whereas if the annealing was done in N2 the order changed to TaNx∼ TaN « Ta < Cr. The peel locus of failure was always in the apparently virgin PI in the Cr/PI samples, while the Ta/PIsamples failed in the modified PI, and the TaN/PI and TaNx/PI samples failed between the Ta-nitride and the Cu peel backing film after thermal cycling. © 1998 Taylor & Francis Group, LLC.
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990