Effects of texture, microstructure, and alloy content on electromigration of aluminum-based metallization
- D.B. Knorr
- K.P. Rodbell
- 1992
- SPIE Microelectronic Processing 1992
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8 results for D.B. Knorr
The role of texture in the electromigration behavior of pure aluminum lines
- D.B. Knorr
- K.P. Rodbell
- 1996
- Journal of Applied Physics
Correlation between special grain boundaries and electromigration behavior of aluminum thin films
- K.T. Lee
- J.A. Szpunar
- et al.
- 1995
- Canadian Metallurgical Quarterly
Correlation between special grain boundaries and electromigration behavior of aluminum thin films
- K.T. Lee
- J.A. Szpunar
- et al.
- 1995
- Canadian Metallurgical Quarterly
Texture in multilayer metallization structures
- D.P. Tracy
- D.B. Knorr
- et al.
- 1994
- Journal of Applied Physics
Crystallographic texture change during abnormal grain growth in Cu-Co thin films
- J.M.E. Harper
- J. Gupta
- et al.
- 1994
- Applied Physics Letters
The microstructure, mechanical stress, texture, and electromigration behavior of Al-Pd alloys
- K.P. Rodbell
- D.B. Knorr
- et al.
- 1993
- Journal of Electronic Materials
Correlation of texture with electromigration behavior in Al metallization
- D.B. Knorr
- D.P. Tracy
- et al.
- 1991
- Applied Physics Letters