Cu CMP edge uniformity improvement studies for 32 nm technology node and beyond
- John H. Zhang
- Laertis Economikos
- et al.
- 2010
- MRS Online Proceedings Library
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Evaluation of barrier CMP slurries and characterization of ULK material properties shifts due to CMP
- Wei-Tsu Tseng
- Dimitri Kioussis
- et al.
- 2008
- ECS Meeting 2008