Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
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4 results for Steven B. Medd
Reducing time dependent line to line leakage following post CMP clean
- Donald F. Canaperi
- Satyavolu S. Papa Rao
- et al.
- 2010
- MRS Online Proceedings Library
Silicon-on-insulator MOSFETs with hybrid crystal orientations
- M. Yang
- K.K. Chan
- et al.
- 2006
- VLSI Technology 2006
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005