Flow-induced spatial non-uniformity and anisotropy in electrically conductive adhesives
- Brian Smith
- Alexander Bonetti
- et al.
- 2009
- SEMI-THERM 2009
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6 results for B. Smith
Design of thermal interfaces with embedded microchannels to control bond line formation
- Brian Smith
- Hugo Rothuizen
- et al.
- 2008
- ITherm 2008
High-performance thermal interface technology overview
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- THERMINIC 2007
Utility of transient testing to characterize thermal interface materials
- B. Smith
- T. Brunschwiler
- et al.
- 2007
- THERMINIC 2007
Comparison of transient and static test methods for chip-to-sink thermal interface characterization
- B. Smith
- T. Brunschwiler
- et al.
- 2009
- Microelectronics Journal
Toward zero-emission data centers through direct reuse of thermal energy
- T. Brunschwiler
- B. Smith
- et al.
- 2009
- IBM J. Res. Dev