(110) Channel, SiON gate-dielectric PMOS with record high Ion=1 mA/μm through channel stress and source drain external resistance (R ext) engineeringB. YangA. Waiteet al.2007IEDM 2007
Direct silicon bonded (DSB) substrate solid phase epitaxy (SPE) integration scheme study for high performance bulk CMOSHaizhou YinC.Y. Sunget al.2006IEDM 2006
Novel enhanced stressor with graded embedded SiGe source/drain for high performance CMOS devicesJ.-P. HanH. Utomoet al.2006IEDM 2006
High performance CMOS bulk technology using direct silicon bond (DSB) mixed crystal orientation substratesChun-Yung SungHaizhou Yinet al.2005IEDM 2005
Design of high performance PFETs with strained Si channel and laser annealZ. LuoY.F. Chonget al.2005IEDM 2005
High performance and low power transistors integrated in 65nm bulk CMOS technologyZ. LuoA. Steegenet al.2004IEDM 2004
SMT and enhanced SPT with Recessed SD to improve CMOS Device PerformanceS. FangS.S. Tanet al.2008ICSICT 2008
Channel Strain Characterization in Embedded SiGe by Nano-beam DiffractionJ. LiA. Lambertiet al.2008ECS Meeting 2008
Effect of end-of-range defects on device leakage in direct silicon bonded (DSB) technologyHaizhou YinM. Hamaguchiet al.2008VLSI-TSA 2008
Scalability of Direct Silicon Bonded (DSB) technology for 32nm node and beyondHaizhou YinC.Y. Sunget al.2007VLSI Technology 2007