A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
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16 results for B. Herbst
Growth of crystalline defects on the surface of FSG dielectrics
- J.P. Gambino
- J. Burnham
- et al.
- 2003
- AMC 2003
Does line edge roughness matter?: FEOL and BEOL perspectives
- Qinghuang Lin
- Chuck Black
- et al.
- 2003
- Microlithography 2003
Low dielectric constant nanocomposite thin films based on silica nanoparticle and organic thermosets
- Qinghuang Lin
- Stephen A. Cohen
- et al.
- 2007
- Journal of Polymer Science, Part B: Polymer Physics
Atom motion of Cu and Co in Cu damascene lines with a CoWP cap
- C.-K. Hu
- L. Gignac
- et al.
- 2004
- Applied Physics Letters
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters