Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2005
- CICC 2005
Publications
Date
Featured collections
Popular topics
14 results for Joanna Rosner
Terabus: Terabit/second-class card-level optical interconnect technologies
- Laurent Schares
- Jeffrey A. Kash
- et al.
- 2006
- IEEE Journal on Selected Topics in Quantum Electronics
Fabrication challenges for next-generation devices: Microelectromechanical systems for radio-frequency wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2003
- Journal of Microlithography, Microfabrication and Microsystems
Fabrication challenges for next generation devices: MEMS for RF wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2002
- Proceedings of SPIE - The International Society for Optical Engineering