Crystallographic texture and phase metrology during damascene copper processing
- K.J. Kozaczek
- P. DeHaven
- et al.
- 2002
- MRS Proceedings 2002
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17 results for S. Malhotra
An optimal liner for copper damascene interconnects
- D. Edelstein
- C. Uzoh
- et al.
- 2001
- ADMETA 2001
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
Effect of metal liner on electromigration in Cu Damascene lines
- C.-K. Hu
- L. Gignac
- et al.
- 2005
- Journal of Applied Physics
Picosecond ultrasonics study of the vibrational modes of a nanostructure
- G. Andrew Antonelli
- Humphrey J. Maris
- et al.
- 2002
- Journal of Applied Physics
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2001
- Applied Physics Letters
Microstructural analysis of copper interconnections using picosecond ultrasonics
- James M.E. Harper
- Sandra G. Malhotra
- et al.
- 2000
- Materials Research Society Symposium-Proceedings