Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
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8 results for A. Sharma
Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
- S.L. Wright
- R.J. Polastre
- et al.
- 2006
- ECTC 2006
Adaptive Servo Control of Vibration Induced Error
- M. Sri-Jayantha
- Hien Dang
- et al.
- 2003
- IECON 2003
TrueTrack™ servo technology for high track density storage
- S. Sri-Jayantha
- Hien Dang
- et al.
- 2000
- APMRC 2000
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
- L. Valdevit
- V.D. Khanna
- et al.
- 2008
- Microelectronics Reliability
3D chip stacking with C4 technology
- Bing Dang
- Steven L. Wright
- et al.
- 2008
- IBM J. Res. Dev
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
TrueTrack™ servo technology for high TPI disk drives
- Sri M. Sri-Jayantha
- Hien Dang
- et al.
- 2001
- IEEE Transactions on Magnetics