Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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43 results for James Kelly

64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- - Shyng-Tsong Chen
  - Hideyuki Tomizawa
  - et al.
- 2011
- IITC/MAM 2011
Effect of impurity on Cu electromigration
- - C.-K. Hu
  - Matthew Angyal
  - et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Metallization opportunities and challenges for future back-end-of-the-line technology
- - Cyril Cabral Jr.
  - Benjamin Fletcher
  - et al.
- 2010
- ADMETA 2010
CVD Co and its application to Cu damascene interconnections
- - Takeshi Nogami
  - J. Maniscalco
  - et al.
- 2010
- IITC 2010
Deposition of copper on ruthenium for Cu metallization
- - J. Kelly
  - O. Van Der Straten
  - et al.
- 2010
- ECS Transactions
Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- - Takeshi Nogami
  - Chih-Chao Yang
  - et al.
- 2008
- ADMETA 2008
Copper contact metallization using Ru-based barrier liners for 45 nm and 32 nm nodes: Reliability and device performance
- - Soon-Cheon Seo
  - Chih-Chao Yang
  - et al.
- 2008
- ADMETA 2008
Robust and low cost copper contact application for low power device at 32 nm-node and beyond
- - Atsunobu Isobayashi
  - James J. Kelly
  - et al.
- 2009
- IITC 2009
Copper contact metallization for 22 nm and beyond
- - Soon-Cheon Seo
  - Chih-Chao Yang
  - et al.
- 2009
- IITC 2009
Morphology of electrodeposited Cu on 300 mm PEALD Ru substrates
- - J. Kelly
  - T. Vo
  - et al.
- 2008
- ECS Meeting 2008