Deposition of copper on ruthenium for Cu metallization
- J. Kelly
- O. Van Der Straten
- et al.
- 2010
- ECS Transactions
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43 results for James Kelly
Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- Takeshi Nogami
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Copper contact metallization using Ru-based barrier liners for 45 nm and 32 nm nodes: Reliability and device performance
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Robust and low cost copper contact application for low power device at 32 nm-node and beyond
- Atsunobu Isobayashi
- James J. Kelly
- et al.
- 2009
- IITC 2009
Copper contact metallization for 22 nm and beyond
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2009
- IITC 2009
Suppressor effects during copper superfilling of sub-100 nm lines
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2009
- Electrochemical and Solid-State Letters
Morphology of electrodeposited Cu on 300 mm PEALD Ru substrates
- J. Kelly
- T. Vo
- et al.
- 2008
- ECS Meeting 2008
Electrodeposition of Cu on Ta-based layers: I. Electrodeposition on Ta
- M. Zheng
- J. Kelly
- et al.
- 2007
- JES
Electrodeposition of Cu on Ta-based layer II: Cu Electrodeposition on Cu/Ta bilayers
- J. Kelly
- M. Zheng
- et al.
- 2007
- JES
Electrodeposition of Ni from low-temperature sulfamate electrolytes
- S.H. Goods
- J. Kelly
- et al.
- 2006
- JES