Annealing and impurity effects in co thin films for MOL Contact and BEOL metallization
- James Kelly
- Vimal Kamineni
- et al.
- 2018
- JES
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43 results for James Kelly
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- James Kelly
- X. Lin
- et al.
- 2013
- JES
Cu reflows on Ru
- C.-C. Yang
- Baozhen Li
- et al.
- 2013
- ECS Solid State Letters
Mechanism of co liner as enhancement layer for Cu interconnect gap-fill
- M. He
- X. Zhang
- et al.
- 2013
- JES
Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
- James Kelly
- Charan Surisetty
- et al.
- 2013
- Comptes Rendus Chimie
Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- J. Kelly
- Takeshi Nogami
- et al.
- 2012
- JES
Suppressor effects during copper superfilling of sub-100 nm lines
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2009
- Electrochemical and Solid-State Letters
Electrodeposition of Cu on Ta-based layers: I. Electrodeposition on Ta
- M. Zheng
- J. Kelly
- et al.
- 2007
- JES
Electrodeposition of Cu on Ta-based layer II: Cu Electrodeposition on Cu/Ta bilayers
- J. Kelly
- M. Zheng
- et al.
- 2007
- JES
Electrodeposition of Ni from low-temperature sulfamate electrolytes
- S.H. Goods
- J. Kelly
- et al.
- 2006
- JES