Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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43 results for James Kelly

Annealing and impurity effects in co thin films for MOL Contact and BEOL metallization
- - James Kelly
  - Vimal Kamineni
  - et al.
- 2018
- JES
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- - James Kelly
  - X. Lin
  - et al.
- 2013
- JES
Cu reflows on Ru
- - C.-C. Yang
  - Baozhen Li
  - et al.
- 2013
- ECS Solid State Letters
Mechanism of co liner as enhancement layer for Cu interconnect gap-fill
- - M. He
  - X. Zhang
  - et al.
- 2013
- JES
Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
- - James Kelly
  - Charan Surisetty
  - et al.
- 2013
- Comptes Rendus Chimie
Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- - J. Kelly
  - Takeshi Nogami
  - et al.
- 2012
- JES
Suppressor effects during copper superfilling of sub-100 nm lines
- - Q. Huang
  - B.C. Baker-O'Neal
  - et al.
- 2009
- Electrochemical and Solid-State Letters
Electrodeposition of Cu on Ta-based layers: I. Electrodeposition on Ta
- - M. Zheng
  - J. Kelly
  - et al.
- 2007
- JES
Electrodeposition of Cu on Ta-based layer II: Cu Electrodeposition on Cu/Ta bilayers
- - J. Kelly
  - M. Zheng
  - et al.
- 2007
- JES
Electrodeposition of Ni from low-temperature sulfamate electrolytes
- - S.H. Goods
  - J. Kelly
  - et al.
- 2006
- JES