Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Publications
28 results for Koichi Motoyama
First Demonstration of 16nm Pitch Subtractive Ru Interconnects for Advanced Technology Nodes
- C. Penny
- K. Motoyama
- et al.
- 2025
- IITC 2025
Reliability and Performance Enhancement for Fully Subtractive Ru Topvia Interconnects
- Koichi Motoyama
- 2025
- IITC 2025
A Perspective on Interconnect Scaling Challenges in the NanoStack Transistor Era AP/DFM: Advanced Patterning/Design for Manufacturing (Design-Technology Co-Optimization)
- Nicholas A. Lanzillo
- Shahrukh Khan
- et al.
- 2025
- ASMC 2025
Application of Cu Reflow Process on Ru Liner for Advanced Nanoscale Interconnects
- K. Motoyama
- O. van der Straten
- 2024
- ECS J. Solid State Sci. Technol.
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
- Koichi Motoyama
- Nicholas A. Lanzillo
- et al.
- 2022
- IITC 2022
EM performance improvements for Cu interconnects with Ru-based liner and Co cap in advanced nodes: (Invited)
- Koichi Motoyama
- 2021
- IITC 2021
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021