A 90nm dual damascene hybrid (organic / inorganic) low-k - Copper BEOL integration scheme
- T. Dalton
- A. Cowley
- et al.
- 2003
- ADMETA 2003
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27 results for Laertis Economikos
Structural demonstration of cost effective Isolation Trench fill for sub-110nm vertical trench DRAM and SOC applications
- S.-W. Yang
- W.-S. Liao
- et al.
- 2003
- VLSI-TSA 2003
Study of arsenic out-diffusion for buried plate formation in trench capacitors
- L. Economikos
- C.S. Murthy
- et al.
- 1998
- IEMT 1998
Applications of latent open test
- Laertis Economikos
- Shinwu Chiang
- et al.
- 1994
- MCMC 1994
Post cu cmp cleaning of polyurethane pad debris
- Wei-Tsu Tseng
- Elliott Rill
- et al.
- 2013
- ECS J. Solid State Sci. Technol.
Post copper CMP hybrid clean process for advanced BEOL technology
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- IEEE Trans Semicond Manuf
Enabling scatterometry as an in-line measurement technique for 32 nm BEOL application
- M. Golam Faruk
- Shahin Zangooie
- et al.
- 2011
- IEEE Trans Semicond Manuf