Temperature and Bias Effects on the Physical and Tribological Properties of Diamond-Like Carbon
- A. Grill
- V.V. Patel
- et al.
- 2019
- JES
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155 results for Alfred Grill
Optimal filler sizes for thermal interface materials
- Piyas Chowdhury
- Kamal Sikka
- et al.
- 2019
- ITherm 2019
Extreme-low k porous pSiCOH dielectrics prepared by PECVD
- H. You
- Petra Mennell
- et al.
- 2018
- JVSTB
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- Takeshi Nogami
- X. Zhang
- et al.
- 2017
- VLSI Technology 2017
SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH: Reactive ion etching and dielectric recovery
- John N. Myers
- Xiaoxian Zhang
- et al.
- 2017
- Applied Physics Letters
Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2017
- JVSTB
Post porosity plasma protection integration at 48 nm pitch
- H. Huang
- Krystelle Lionti
- et al.
- 2016
- IITC/AMC 2016
Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2016
- IITC/AMC 2016
PECVD low and ultralow dielectric constant materials: From invention and research to products
- Alfred Grill
- 2016
- JVSTB
SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH
- Xiaoxian Zhang
- John N. Myers
- et al.
- 2016
- Journal of Applied Physics