Publications

3 results for Taesun Kim

Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- - Koichi Motoyama
  - Jaemyung Choi
  - et al.
- 2024
- IEDM 2024
Backside power distribution for nanosheet technologies beyond 2nm
- - Ruilong Xie
  - Wonhyuk Hong
  - et al.
- 2024
- VLSI Technology and Circuits 2024
EUV Double Patterning Solution for Subtractive Metal Patterning at 18nm Pitch
- - Chris Penny
  - Koichi Motoyama
  - et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024