Advanced interconnect technologies in the era of cognitive computing
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2016
- Pan Pacific 2016
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24 results for Akihiro Horibe
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
- Kuniaki Sueoka
- Akihiro Horibe
- et al.
- 2015
- 3DIC 2015
Through silicon via process for effective multi-wafer integration
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2015
- ECTC 2015
Wafer-level non conductive films for exascale servers
- Akihiro Horibe
- Sayuri Kohara
- et al.
- 2014
- ECTC 2014
Fine-pitch solder joining for high density interconnection
- Kuniaki Sueoka
- Sayuri Kohara
- et al.
- 2014
- ICEP 2014
Thermo-mechanical evaluation of 3D packages
- Sayuri Kohara
- Akihiro Horibe
- et al.
- 2013
- 3DIC 2013
High thermal conductive inter chip fill for 3D-IC through pre-applied joining process
- Y. Kawase
- M. Ikemoto
- et al.
- 2013
- IMAPS 2013
Scaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
Thermally enhanced pre-applied underfills for 3D integration
- Akihiro Horibe
- Keishi Okamoto
- et al.
- 2013
- ECTC 2013
No Clean Flux technology for large die flip chip packages
- Akihiro Horibe
- Kang-Wook Lee
- et al.
- 2013
- ECTC 2013