Katsuyuki Sakuma, Spyridon Skordas, et al.
ECTC 2014
A vertical interconnect technology for stacking micro solid thin film batteries (STFB) in IoT devices is proposed. This technology consists of stacking glass substrates with a layer of solid thin film battery, drilling by laser machining, filling the holes with solder to connect the stacked batteries, and dicing the stacked wafer to 1×1 mm micro stacked batteries. In this work, various metals are evaluated to identify the appropriate electrode drilled with glass and resin. The effects of the laser wavelength are also investigated.
Katsuyuki Sakuma, Spyridon Skordas, et al.
ECTC 2014
Shintaro Yamamichi, Akihiro Horibe, et al.
VLSI Technology 2017
Chinami Marushima, Toyohiro Aoki, et al.
ECTC 2022
Akihiro Horibe, Keishi Okamoto, et al.
ECTC 2013