Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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10 results for Risa Miyazawa

Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- - Qianwen Chen
  - Michael Belyansky
  - et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Risa Miyazawa
  - et al.
- 2023
- ECTC 2023
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- - Keiji Matsumoto
  - Takahito Watanabe
  - et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- - Chinami Marushima
  - Toyohiro Aoki
  - et al.
- 2022
- ECTC 2022
Vertical interconnect technology for enlarging capacity on micro solid thin film rechargeable battery
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2019
- ECTC 2019
Solder Injected through Via for Multi Stacked Wafers
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2016
- ECTC 2016
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- - Risa Miyazawa
  - Hiroyuki Mori
  - et al.
- 2023
- iTHERM 2023
Thermal modeling of Direct Bonded Heterogenous Integration (DBHi) MCM package with Si microcooler
- - Risa Miyazawa
  - Takashi Hisada
  - et al.
- 2022
- ITherm 2022
CFD analysis of molten solder flow behavior and bridging mechanism during solder bump formation
- - Risa Miyazawa
  - Keishi Okamoto
  - et al.
- 2019
- InterPACK 2019
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
- - Risa Miyazawa
  - Eiji Nakamura
  - et al.
- 2021
- Advancing Microelectronics