Developments in integrated on-chip inductors with magnetic yokes
- Eugene J. O'Sullivan
- Naigang Wang
- et al.
- 2012
- PRiME/ECS Meeting 2012
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44 results for Bucknell Webb
Interconnect processes and reliability for RF technology
- Jeffrey P. Gambino
- F. Anderson
- et al.
- 2011
- IPFA 2011
Stress characterization of tungsten-filled through silicon via arrays using very high resolution multi-wavelength raman spectroscopy
- Jeff Gambino
- Daniel Vanslette
- et al.
- 2011
- ECS Transactions
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
Limits to on-chip power conversion with thin film inductors
- Philipp Herget
- Naigang Wang
- et al.
- 2013
- IEEE Transactions on Magnetics
A study of current density limits due to saturation in thin film magnetic inductors for on-chip power conversion
- Philipp Herget
- Naigang Wang
- et al.
- 2012
- IEEE Transactions on Magnetics
Integrated on-chip inductors with electroplated magnetic yokes (invited)
- Naigang Wang
- Eugene J. O'Sullivan
- et al.
- 2012
- Journal of Applied Physics
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
3D chip stacking with C4 technology
- Bing Dang
- Steven L. Wright
- et al.
- 2008
- IBM J. Res. Dev