Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- Takeshi Nogami
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Publications
16 results for J. Wynne
Copper contact metallization for 22 nm and beyond
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2009
- IITC 2009
PEALD Ru liner conformality and Cu trench fill characteristics
- O. Van Der Straten
- J. Wynne
- et al.
- 2008
- ECS Meeting 2008
Stress migration lifetime for Cu interconnects with CoWP-only cap
- Jeffrey P. Gambino
- Christy L. Johnson
- et al.
- 2006
- IEEE T-DMR
Damascene copper integration impact on electomigration and stress migration
- Anthony K. Stamper
- H. Baks
- et al.
- 2005
- AMC 2005
Effect of CoWP cap thickness on via yield and reliability for Cu interconnects with CoWP-only cap process
- J.P. Gambino
- J. Wynne
- et al.
- 2005
- IITC 2005