Damascene copper integration impact on electomigration and stress migration
- Anthony K. Stamper
- H. Baks
- et al.
- 2005
- AMC 2005
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14 results for J. Wynne
Effect of CoWP cap thickness on via yield and reliability for Cu interconnects with CoWP-only cap process
- J.P. Gambino
- J. Wynne
- et al.
- 2005
- IITC 2005
Study of TiN and TaN underlayer properties and their influence on W growth
- Shanti Pancharatnam
- Gabriel Rodriguez
- et al.
- 2019
- IEEE Trans Semicond Manuf
CMP Challenges for Advanced Technology Nodes
- John H Zhang
- Haigou Huang
- et al.
- 2017
- MRS Advances