Manufacturing Yield Improvement for Advanced CMOS Technology Middle-of-Line Interconnect with Cobalt Metallization : YE: YieldEnhancement/Learning
- Susan Fan
- P. Jamison
- et al.
- 2023
- ASMC 2023
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14 results for J. Wynne
Parasitic Resistance Reduction for Aggressively Scaled Stacked Nanosheet Transistors
- Su-Chen Fan
- Ruilong Xie
- et al.
- 2020
- IITC 2020
Effect of chamber surface coat on TiN film growth
- Shanti Pancharatnam
- J. Wynne
- et al.
- 2019
- ASMC 2019
Study of titanium nitride underlayer properties and its influence on tungsten growth
- Shanti Pancharatnam
- J. Wynne
- et al.
- 2018
- ASMC 2018
Method of problem solving to diagnose high particle failures due to unique rotation stopping position: CFM: Contamination free manufacturing
- Jessica Gruss-Gifford
- T. Haigh
- et al.
- 2018
- ASMC 2018
Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- Takeshi Nogami
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Copper contact metallization using Ru-based barrier liners for 45 nm and 32 nm nodes: Reliability and device performance
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Copper contact metallization for 22 nm and beyond
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2009
- IITC 2009
PEALD Ru liner conformality and Cu trench fill characteristics
- O. Van Der Straten
- J. Wynne
- et al.
- 2008
- ECS Meeting 2008
Stress migration lifetime for Cu interconnects with CoWP-only cap
- Jeffrey P. Gambino
- Christy L. Johnson
- et al.
- 2006
- IEEE T-DMR