Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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30 results for P. S. McLaughlin

The effect of a threshold failure time and bimodal behavior on the electromigration lifetime of copper interconnects
- - R. Filippi
  - P.-C. Wang
  - et al.
- 2009
- IRPS 2009
Material and process for advanced Cu/ULK integration
- - Chih-Chao Yang
  - Daniel C. Edelstein
  - et al.
- 2008
- ADMETA 2008
Line edge roughness and spacing effect on low-k TDDB characteristics
- - F. Chen
  - J.R. Lloyd
  - et al.
- 2008
- IRPS 2008
A comprehensive study of low-k SiCOH TDDB phenomena and its reliability lifetime model development
- - F. Chen
  - O. Bravo
  - et al.
- 2006
- IRPS 2006
Electromigration in sub-micron Cu interconnects in low k dielectrics
- - B.N. Agarwala
  - D. Nguyen
  - et al.
- 2005
- ECS Meeting 2005
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004
Integration of copper and fluorosilicate glass for 0.18 μm interconnections
- - E. Barth
  - T. Ivers
  - et al.
- 2000
- IITC 2000
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- - J. Heidenreich
  - D. Edelstein
  - et al.
- 1998
- IITC 1998
Electromigration challenges for nanoscale Cu wiring
- - C.-K. Hu
  - L. Gignac
  - et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008