Delayed mechanical failure of the under-bump interconnects by bump shearing
- Han Li
- Thomas M. Shaw
- et al.
- 2012
- Journal of Applied Physics
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48 results for Xiao Hu Liu
Robust ultrathin (20-25 nm) trilayer dielectric low k Cu damascene cap for sub-30 nm nanoelectronic devices
- Son Nguyen
- T. Haigh
- et al.
- 2011
- ECS Meeting 2011
Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- R.R. Yu
- F. Liu
- et al.
- 2009
- VLSI Technology 2009
On the contribution of line-edge roughness to intralevel TDDB lifetime in low-k dielectrics
- J.R. Lloyd
- X.-H. Liu
- et al.
- 2009
- IRPS 2009
Size-dependent modulation of carrier mobility in top-down fabricated silicon nanowires
- Lidija Sekaric
- Oki Gunawan
- et al.
- 2009
- Applied Physics Letters
Evidence for electronic gap-driven metal-semiconductor transition in phase-change materials
- Dmitry Shakhvorostov
- Razvan A. Nistor
- et al.
- 2009
- PNAS
A multilevel copper/low-k/airgap BEOL technology
- S.V. Nitta
- S. Ponoth
- et al.
- 2007
- ADMETA 2007
Performance and reliability of airgaps for advanced BEOL Interconnects
- S.V. Nitta
- D. Edelstein
- et al.
- 2008
- IITC 2008
Chip package interaction in ultra low-k/copper interconnect technology
- X.-H. Liu
- T.M. Shaw
- et al.
- 2007
- ICEPT 2007
Experimental determination of the toughness of crack stop structures
- T.M. Shaw
- E. Liniger
- et al.
- 2007
- IITC 2007