CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
Publications
Date
Featured collections
Popular topics
48 results for Xiao Hu Liu
Mechanisms of Electromigration Damage in Cu Interconnects
- C. K. Hu
- Lynne Gignac
- et al.
- 2018
- IEDM 2018
Impact of pattern collapse on future micro/nano fabrication
- Xiao Hu Liu
- 2017
- IITC 2017
Tri-layer nanoindentation for mechanical characterization of ultra-low-k dielectrics
- Tingge Xu
- Yingjie Du
- et al.
- 2017
- IITC 2017
A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film
- Yingjie Du
- Tingge Xu
- et al.
- 2017
- Extreme Mechanics Letters
Single Crystal Flexible Electronics Enabled by 3D Spalling
- Ning Li
- Stephen W. Bedell
- et al.
- 2017
- Advanced Materials
Creep characterization of solder bumps using nanoindentation
- Yingjie Du
- Xiao Hu Liu
- et al.
- 2016
- Mechanics of Time-Dependent Materials
The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2016
- IRPS 2016
Thin film wrinkling by strain mismatch on 3D surfaces
- Huan Hu
- Changjin Huang
- et al.
- 2016
- Extreme Mechanics Letters
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016