Chip-package-interaction modeling of ultra low-k/copper back end of line
- X.-H. Liu
- T.M. Shaw
- et al.
- 2007
- IITC 2007
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48 results for Xiao Hu Liu
Delamination in patterned films
- X.-H. Liu
- M.W. Lane
- et al.
- 2007
- Int. J. Solids Struct.
Integration of local stress techniques with strained-Si directly on insulator (SSDOI) substrates
- Haizhou Yin
- Z. Ren
- et al.
- 2006
- VLSI Technology 2006
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- V. McGahay
- G. Bonilla
- et al.
- 2006
- IITC 2006
Theory for electromigration failure in Cu conductors
- J.R. Lloyd
- C.E. Murray
- et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
Analysis and modeling of curvature in copper-based mems structures fabricated using CMOS interconnect technology
- Marie-Ange Eyoum
- Nils Hoivik
- et al.
- 2005
- TRANSDUCERS 2005
Modelling of dislocations intersecting a free surface
- X.-H. Liu
- K.W. Schwarz
- 2005
- Modelling and Simulation in Materials Science and Engineering
Low-k BEOL mechanical modeling
- Xiao Hu Liu
- Michael W. Lane
- et al.
- 2004
- ADMETA 2004