Post ion-implant photoresist removal via wet chemical cleans combined with physical force pretreatments
- G.G. Totir
- M.M. Frank
- et al.
- 2007
- ECS Meeting 2007
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3 results for P.W. Mertens
Chemical and structural modifications in a 193-nm photoresist after low-k dry etch
- E. Kesters
- M. Claes
- et al.
- 2008
- Thin Solid Films
Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions
- I. Teerlinck
- P.W. Mertens
- et al.
- 1996
- JES