Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
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8 results for Erich Klink
Signal propagation over perforated reference planes
- Lei Shan
- Mark Ritter
- et al.
- 2007
- IEEE-SPI 2007
Attenuation measurement technique for printed circuit board traces in a production environment
- Christian Schuster
- Alina Deutsch
- et al.
- 2006
- IEEE-SPI 2006
Practical considerations in the modeling and characterization of printed-circuit board wiring
- A. Deutsch
- R.S. Krabbenhoft
- et al.
- 2006
- IEEE-SPI 2006
Using S-parameters successfully in time domain link simulations
- Dierk Kaller
- Christian Schuster
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Issues and challenges of Gbps backplane connector characterization
- Christian Schuster
- Young H. Kwark
- et al.
- 2004
- IEEE-SPI 2004
The evolution of build-up package technology and its design challenges
- Edmund D. Blackshear
- Moises Cases
- et al.
- 2005
- IBM J. Res. Dev