A new in-situ approach to flip-chip interconnect characterization up to millimeter wave FRequencies
- Ullrich R. Pfeiffer
- Arun Chandrasekhar
- et al.
- 2004
- IEEE-SPI 2004
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4 results for Arun Chandrasekhar
Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
- Ullrich Pfeiffer
- Arun Chandrasekhar
- 2003
- IEEE Topical Meeting EPEPS 2003
Determination of the complex permittivity of packaging materials at millimeter-wave frequencies
- Thomas Zwick
- Arun Chandrasekhar
- et al.
- 2006
- IEEE T-MTT
Characterization of flip-chip interconnects up to millimeter-wave frequencies based on a nondestructive in situ approach
- Ullrich R. Pfeiffer
- Arun Chandrasekhar
- 2005
- IEEE Transactions on Advanced Packaging