Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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27 results for Yann Mignot

Microstructure modulation for resistance reduction in copper interconnects
- - Chih-Chao Yang
  - Terry A. Spooner
  - et al.
- 2017
- IITC 2017
DSA patterning options for logics and memory applications
- - Chi Chun Liu
  - Elliott Franke
  - et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- - Cheng Chi
  - Chi Chun Liu
  - et al.
- 2017
- SPIE Advanced Lithography 2017
BEOL process integration for the 7 nm technology node
- - T. Standaert
  - Genevieve Beique
  - et al.
- 2016
- IITC/AMC 2016
Tungsten and cobalt metallization: A material study for MOL local interconnects
- - Vimal Kamineni
  - Mark Raymond
  - et al.
- 2016
- IITC/AMC 2016
Lithographic qualification of high-Transmission mask blank for 10nm node and beyond
- - Yongan Xu
  - Tom Faure
  - et al.
- 2016
- SPIE Advanced Lithography 2016
EUV patterning successes and frontiers
- - Nelson Felix
  - Daniel Corliss
  - et al.
- 2016
- SPIE Advanced Lithography 2016
Impact of source/drain silicon cap on FDSOI SiGe pMOSFET performance
- - E. Augendre
  - S. Maitrejean
  - et al.
- 2015
- S3S 2015
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
- - Yannick Feurprier
  - Katie Lutker-Lee
  - et al.
- 2015
- SPIE Advanced Lithography 2015
Plasma etch challenges with new EUV lithography material introduction for patterning for MOL and BEOL
- - Changwoo Lee
  - Bhaskar Nagabhirava
  - et al.
- 2015
- SPIE Advanced Lithography 2015