Microstructure modulation for resistance reduction in copper interconnects
- Chih-Chao Yang
- Terry A. Spooner
- et al.
- 2017
- IITC 2017
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27 results for Yann Mignot
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- Cheng Chi
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
BEOL process integration for the 7 nm technology node
- T. Standaert
- Genevieve Beique
- et al.
- 2016
- IITC/AMC 2016
Tungsten and cobalt metallization: A material study for MOL local interconnects
- Vimal Kamineni
- Mark Raymond
- et al.
- 2016
- IITC/AMC 2016
Lithographic qualification of high-Transmission mask blank for 10nm node and beyond
- Yongan Xu
- Tom Faure
- et al.
- 2016
- SPIE Advanced Lithography 2016
EUV patterning successes and frontiers
- Nelson Felix
- Daniel Corliss
- et al.
- 2016
- SPIE Advanced Lithography 2016
Impact of source/drain silicon cap on FDSOI SiGe pMOSFET performance
- E. Augendre
- S. Maitrejean
- et al.
- 2015
- S3S 2015
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
- Yannick Feurprier
- Katie Lutker-Lee
- et al.
- 2015
- SPIE Advanced Lithography 2015
Plasma etch challenges with new EUV lithography material introduction for patterning for MOL and BEOL
- Changwoo Lee
- Bhaskar Nagabhirava
- et al.
- 2015
- SPIE Advanced Lithography 2015