Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Publications
29 results for Yann Mignot
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- D. Edelstein
- A. Jog
- et al.
- 2025
- IITC 2025
In-depth feasibility study of extreme ultraviolet damascene extension: Patterning, dielectric etch, and metallization
- Xinghua Sun
- Yann Mignot
- et al.
- 2022
- Journal of Vacuum Science and Technology B
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning
- Chi Chun Liu
- Richard Farrell
- et al.
- 2019
- MEMS/NEMS/MOEMS 2019
LCDU improvement of EUV-patterned vias with DSA
- Jing Guo
- Dustin W. Janes
- et al.
- 2019
- MEMS/NEMS/MOEMS 2019
Defect detection strategies and process partitioning for single-expose EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Inorganic hardmask development for extreme ultraviolet patterning
- Anuja De Silva
- A. Dutta
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
A Study on SADP Process Refresh for Patterning Correction
- James H.-C. Chen
- Isabel C Estrada-Raygoza
- et al.
- 2018
- IITC 2018
The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
- Chi-Chun Liu
- Yann Mignot
- et al.
- 2018
- SPIE Advanced Lithography 2018