UV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modules
- N. Inoue
- F. Ito
- et al.
- 2013
- IITC 2013
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27 results for Yann Mignot
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
- James Hsueh-Chung Chen
- Christopher Waskiewicz
- et al.
- 2012
- IITC 2012
64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
Plasma etch challenges for porous low k materials for 32nm and beyond
- Catherine Labelle
- R. Srivastava
- et al.
- 2011
- CSTIC 2011
In-depth feasibility study of extreme ultraviolet damascene extension: Patterning, dielectric etch, and metallization
- Xinghua Sun
- Yann Mignot
- et al.
- 2022
- Journal of Vacuum Science and Technology B
Inorganic hardmask development for extreme ultraviolet patterning
- Anuja De Silva
- A. Dutta
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Defect detection strategies and process partitioning for single-expose EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS