Thermal fracture toughness measurement for underfill during temperature change
- Soojae Park
- Claudius Feger
- 2011
- Microelectronics Reliability
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60 results for Claudius Feger
Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2010
- IMAPS 2010
Underfill acceleration factor based on thermal fatigue crack growth rate
- Soojae Park
- Claudius Feger
- et al.
- 2010
- ECTC 2010
Direct measurement of local stress in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2010
- ECTC 2010
The over-bump applied resin wafer-level underfill process: Process, material and reliability
- Claudius Feger
- Nancy LaBianca
- et al.
- 2009
- ECTC 2009
Crack growth rate of thermally induced underfill fatigue
- Soojae Park
- Claudius Feger
- 2009
- ECTC 2009
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2009
- ECTC 2009
Thermal aging of laminate materials and the maximum use temperature of organic packages
- Laura L. Kosbar
- Claudius Feger
- et al.
- 2008
- IMAPS 2008
Cooling rate dependent underfill fracture toughness
- Soojae Park
- Claudius Feger
- et al.
- 2008
- IMAPS 2008
Underfill fracture toughness as a function of cooling rate
- Soojae Park
- Claudius Feger
- 2008
- ECTC 2008