Dual dielectrophoresis controller and fluorescence analysis platform for capillary-driven microfluidics on a portable device
- Ricardo Luis Ohta
- André De Oliveira Botelho
- et al.
- 2019
- SPIE BiOS 2019
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60 results for Claudius Feger
A Platform for Analysis of Nanoscale Liquids with an Array of Sensor Devices Based on Two-Dimensional Material
- Michael Engel
- Peter William Bryant
- et al.
- 2017
- Nano Letters
The Study of Polyimide Film Properties and Adhesion Using a Surface Acoustic Wave Sensor
- D.W. Galipeau
- J.F. Vetelino
- et al.
- 2016
- Journal of Plastic Film & Sheeting
Nanowetting microscopy probes liquid-solid interaction at the nanoscale
- Mathias B. Steiner
- Michael Engel
- et al.
- 2015
- EORC 2015
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
Vacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
Using single-wall carbon nanotubes and raman spectroscopy to measure local stresses in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2011
- IEEE Transactions on CPMT
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- Jae-Woong Nah
- Michael A. Gaynes
- et al.
- 2011
- ECTC 2011
Vacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
High performance wafer level underfill material with high filler loading
- Satoru Katsurayama
- Hiroshi Suzuki
- et al.
- 2011
- ECTC 2011