A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique
- W.K. Choi
- S.K. Kang
- et al.
- 2002
- Journal of Electronic Materials
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Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
- Donald W. Henderson
- Timothy Gosselin
- et al.
- 2002
- Journal of Materials Research