Publications

12 results for Won K. Choi

Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P
- - Y.C. Sohn
  - Jin Yu
  - et al.
- 2004
- Journal of Electronic Materials
Controlling Ag₃Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
- - Sung K. Kang
  - Da-Yuan Shih
  - et al.
- 2004
- JOM
The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- - Sung K. Kang
  - Paul Lauro
  - et al.
- 2004
- Materials Transactions
Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
- - Won Kyoung Choi
  - Sung K. Kang
  - et al.
- 2003
- ECTC 2003
Formation of Ag₃Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- - Sung K. Kang
  - Won Kyoung Choi
  - et al.
- 2003
- ECTC 2003
Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P
- - Y.C. Sohn
  - Jin Yu
  - et al.
- 2003
- Journal of Materials Research
Ag₃Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
- - Sung K. Kang
  - Won Kyoung Choi
  - et al.
- 2003
- JOM
Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders
- - Paul Lauro
  - Sung K. Kang
  - et al.
- 2003
- Journal of Electronic Materials
Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
- - S.K. Kang
  - W.K. Choi
  - et al.
- 2002
- Proceedings - Electronic Components and Technology Conference
Studies of the mechanical and electrical properties of lead-free solder joints
- - S.K. Kang
  - W.K. Choi
  - et al.
- 2002
- Journal of Electronic Materials