Simulation of the deposition of BCC metals including anistropic effects using 3D-filmsT. SmyR.V. Joshi2003AMC 2003
Backend implications for thermal effects in 3d integrated soi structuresD. CeloR.V. Joshiet al.2003AMC 2003
Modeling 3D effects of substrate topography on step coverage and film morphology of thin metal filmsT. SmyS.K. Dewet al.2002Thin Solid Films
An analysis of the role of high energy neutral bombardment in longthrow/collimated sputtering of refractory metal barrier layersT. SmyR.V. Joshiet al.1998Journal of Applied Physics