Novel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
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35 results for Paul Lauro
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Polyimide stress cushion for multichip glass-ceramic module packaging
- D.Y. Shih
- P. Palmateer
- et al.
- 1995
- ECTC 1995
Advanced flexible electronics: Challenges and opportunities
- Stephen W. Bedell
- Davood Shahrjerdi
- et al.
- 2014
- SPIE Defense + Security 2014
High-efficiency thin-film InGaP/(In)GaAs/Ge multijunction solar cells enabled by controlled spalling technology
- Davood Shahrjerdi
- Stephen W. Bedell
- et al.
- 2012
- PVSC 2012
Cost-effective layer transfer by controlled spalling technology
- Stephen W. Bedell
- Davood Shahrjerdi
- et al.
- 2012
- ISSWB 2012
Study of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron barrier layer
- Minhua Lu
- Paul Lauro
- et al.
- 2011
- InterPACK 2011
Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2010
- IMAPS 2010
Electromigration in Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- ICEPT-HDP 2008
Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders
- Paul Lauro
- Sung K. Kang
- et al.
- 2003
- Journal of Electronic Materials