Kerf-less removal of Si, Ge, and III-V layers by controlled spalling to enable low-cost PV technologies
- Stephen W. Bedell
- Davood Shahrjerdi
- et al.
- 2012
- IEEE Journal of Photovoltaics
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35 results for Paul Lauro
High-efficiency thin-film InGaP/InGaAs/Ge tandem solar cells enabled by controlled spalling technology
- Davood Shahrjerdi
- Stephen W. Bedell
- et al.
- 2012
- Applied Physics Letters
Study of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron barrier layer
- Minhua Lu
- Paul Lauro
- et al.
- 2011
- InterPACK 2011
Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2010
- IMAPS 2010
The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- ECTC 2009
Injection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009
Blech effect in Pb-free flip chip solder joint
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Applied Physics Letters
Electromigration in Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- ICEPT-HDP 2008
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- Applied Physics Letters