Donald W. Henderson, James J. Woods, et al.
Journal of Materials Research
The Blech effect in electromigration is studied in flip-chip-like Pb-free solder joint structures. The results from two different studies indicate that the Blech limit (J×L) c (current density times solder length) is close to 30 A/cm in Sn1.8 Ag solders, where the dominating degradation mechanism is Sn self-diffusion. For Sn0.7 Cu solders, where the failure is driven by interstitial diffusion, the Blech effect is not observed. When Blech product is approaching the Blech limit, a steady increase in resistance is replaced by a near-zero resistance change. This saturation in resistance shift significantly extends the electromigration lifetime in SnAg solders. © 2009 American Institute of Physics.
Donald W. Henderson, James J. Woods, et al.
Journal of Materials Research
Sung K. Kang, Paul Lauro, et al.
ECTC 2004
Sungil Cho, Jin Yu, et al.
Symposium on “Challenges in Advanced Thin Films: Microstructures, Interfaces, and Reactions" 2004
Sun-Kyoung Seo, Sung K. Kang, et al.
Journal of Electronic Materials