Layer transfer of bulk gallium nitride by controlled spalling
- Stephen W. Bedell
- Paul Lauro
- et al.
- 2017
- Journal of Applied Physics
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35 results for Paul Lauro
The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- Materials Transactions
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
Vertical light-emitting diode fabrication by controlled spalling
- Stephen W. Bedell
- Can Bayram
- et al.
- 2013
- Applied Physics Express
Layer transfer by controlled spalling
- Stephen W. Bedell
- Keith Fogel
- et al.
- 2013
- Journal of Physics D: Applied Physics
Ultralight high-efficiency flexible InGaP/(In)GaAs tandem solar cells on plastic
- Davood Shahrjerdi
- Stephen W. Bedell
- et al.
- 2012
- Advanced Energy Materials
Kerf-less removal of Si, Ge, and III-V layers by controlled spalling to enable low-cost PV technologies
- Stephen W. Bedell
- Davood Shahrjerdi
- et al.
- 2012
- IEEE Journal of Photovoltaics
High-efficiency thin-film InGaP/InGaAs/Ge tandem solar cells enabled by controlled spalling technology
- Davood Shahrjerdi
- Stephen W. Bedell
- et al.
- 2012
- Applied Physics Letters
Blech effect in Pb-free flip chip solder joint
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Applied Physics Letters
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- Applied Physics Letters