True 3-D displays for avionics and mission crewstations
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
The replacement of lead (Pb)-bearing solders used in the electronic industry with Pb-free solders will become a reality in the near future. Several promising Pb-free solders have recently been identified, including Sn-0.7Cu, Sn-3.5Ag, Sn-3.8Ag-O. 7Cu, and Sn-3.5Ag-4.8Bi (in wt.% with slight variations in composition). These are all Sn-rich solders with melting temperatures between 210°C and 227°C, and are recommended for various soldering applications, including surface mount technology (SMT), plated-through-hole (PTH), hall grid array (BGA), flip-chip bumping, and others. Although a considerable amount of information on Pb-free solders has been published in the last few years, the database on these new materials is still at an infant stage compared with that for Pb-containing solders. This paper addresses several aspects of the current fundamental Materials understanding associated with Pb-free solders and various issues regarding their imminent use in electronic interconnect applications, including microstructure-processing-property relations, mechanical properties, interfacial reactions, and the thermal-fatigue life and failure mechanisms of Pb-free solder joints. © 2005 IBM.
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
Ziyang Liu, Sivaramakrishnan Natarajan, et al.
VLDB
Alfonso P. Cardenas, Larry F. Bowman, et al.
ACM Annual Conference 1975
Renu Tewari, Richard P. King, et al.
IS&T/SPIE Electronic Imaging 1996