Effect of inert gas additive on Cl2-based inductively coupled plasma etching of NiFe and NiFeCo
- K.B. Jung
- H. Cho
- et al.
- 1999
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
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11 results for H. Cho
Relative merits of [formula omitted] and [formula omitted] plasma chemistries for dry etching of magnetic random access memory device elements
- K.B. Jung
- H. Cho
- et al.
- 1999
- Journal of Applied Physics
Corrosion-free dry etch patterning of magnetic random access memory stacks: Effects of ultraviolet illumination
- H. Cho
- K.-P. Lee
- et al.
- 2000
- Journal of Applied Physics
Cl2-based inductively coupled plasma etching of CoFeB, CoSm, CoZr and FeMn
- K.B. Jung
- H. Cho
- et al.
- 1999
- Materials Science and Engineering B: Solid-State Materials for Advanced Technology
Inductively coupled plasma etching of CoFeB, CoZr, CoSm and FeMn thin films in interhalogen mixtures
- H. Cho
- K.B. Jung
- et al.
- 1999
- Materials Science and Engineering B: Solid-State Materials for Advanced Technology
Parametric study of NiFe and NiFeCo high density plasma etching using CO/NH3
- K.B. Jung
- J. Hong
- et al.
- 1999
- JES
Comparison of Cl2/He, Cl2/Ar, and Cl2/Xe plasma chemistries for dry etching of NiFe and NiFeCo
- K.B. Jung
- H. Cho
- et al.
- 1999
- JES
Interhalogen Plasma Chemistries for the Etching of NiMnSb
- H. Cho
- K.B. Jung
- et al.
- 1999
- Electrochemical and Solid-State Letters
Patterning of NiFe and NiFeCo in CO/NH3 high density plasmas
- K.B. Jung
- J. Hong
- et al.
- 1999
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Interhalogen plasma chemistries for dry etch patterning of Ni, Fe, NiFe and NiFeCo thin films
- H. Cho
- K.B. Jung
- et al.
- 1999
- Applied Surface Science