Aluminum dual damascene metallization for 0.175 μm DRAM generations and beyond
- R.F. Schnabel
- L. Clevenger
- et al.
- 2000
- Microelectronic Engineering
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3 results for G.Y. Lee
Challenges of Aluminum RIE Technology at sub 0.45 μm Pitches
- R. Ravikumar
- R. Filippi
- et al.
- 1999
- IITC 1999
Dielectric anti-reflection coating application in a 0.175 μm dual-damascene process
- G.Y. Lee
- Z.G. Lu
- et al.
- 1998
- IITC 1998