J.L. Hurd, K.P. Rodbell, et al.
Applied Physics Letters
This paper presents an overview of issues associated with Al dual damascene process technology. Different integration schemes are discussed and characteristics of metal fill, planarization and reliability are highlighted. Finally, a comparison is made between Al dual damascene, Al RIE, and Cu dual damascene.
J.L. Hurd, K.P. Rodbell, et al.
Applied Physics Letters
U. Wieser, U. Kunze, et al.
Physica E: Low-Dimensional Systems and Nanostructures
Ronald Troutman
Synthetic Metals
Mitsuru Ueda, Hideharu Mori, et al.
Journal of Polymer Science Part A: Polymer Chemistry