Adhesion of poly(4,4′-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin
- J. Yu
- M. Ree
- et al.
- 2000
- Macromolecular Chemistry and Physics
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5 results for T.J. Shin
Self-adhesion of poly(4,4'-oxydiphenylene biphenyltetracarboximide) and its adhesion to substrates
- M. Ree
- Y.H. Park
- et al.
- 2000
- Polymer
Miscibility behavior of polyimide (PI)/poly(arylene ether benzimidazole) (PAEBI) blends and its effects on the adhesion of PI/PAEBI/copper joints
- J. Yu
- M. Ree
- et al.
- 2000
- Polymer
Miscibility of polyimide with polymeric primer and its influence on adhesion of polyimide to the primed copper metal: effect of precursor origin
- J. Yu
- M. Ree
- et al.
- 1999
- Journal of Polymer Science, Part B: Polymer Physics
High-temperature polyimide composites prepared from soluble polymeric and crosslinkable oligomeric precursors: Phase demixing and properties
- M. Ree
- T.J. Shin
- et al.
- 1998
- Polymer