Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Poly(4,4′-oxydiphenylene biphenyltetracarboxamic acid) was synthesized in N-methyl pyrrolidone from biphenyltetracarboxylic dianhydride and 4,4′-oxydiphenylene diamine, and then converted to the polyimide in films by thermal imidization at 400 °C. The polyimide exhibits an exceptionally good self-adhesion (814-1187 J/m2) and also good adhesions (>687 J/m2) to inorganic substrates such as silicon wafer and glass ceramic. An oxygen plasma treatment enhances the self-adhesion highly, whereas a silane primer treatment improves the adhesions to the substrates. In addition, the morphological structure and some other properties were investigated.
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Julien Autebert, Aditya Kashyap, et al.
Langmuir
T.N. Morgan
Semiconductor Science and Technology
A. Gangulee, F.M. D'Heurle
Thin Solid Films